GigaDevice and Navitas have created a joint digital power laboratory, intending to combine GigaDevice’s 32-bit microcontroller products and expertise with power components and related knowledge from ...

Researchers from the Institute for Artificial Intelligence at Peking University, led by Sun Zhong, have developed a ...

Taking only those written in the last week, the most popular stories on our website cover stacking packaging for power modules, EC proposals for a European Space Shield, and Molex buying Smiths ...

Using this technology, pixels measuring ~560nm across can be achieved, equating to 25,000dpi, according to the researchers.

Glass adoption is accelerating from various entry points in high-end performance packaging, including packaging for AI accelerators, HPC, and RF telecom markets, and is building the pillars of a new ...

RED Semiconductor has launched Ordo1, a new IP core designed for RISC‑V processors, and announced its membership in RISC‑V ...

Purnell announced a second trial of digital TV involving 250 to 300 households in Bolton to look specifically at problems encountered by the elderly and vulnerable, although he said this trial would ...

It is the JESD328: LPDDR5/5X Small Outline Compression Attached Memory Module (SOCAMM2) Common Standard. The association says JESD328 is designed to provide a memory platform to deliver modular, ...

Tesla’s Q3 profits were down 37% YoY according to the company’s figures published on Wednesday. Global profits stood at $1.37 billion for July through September, down from $2.17 billion in the same ...

The Saras Tile, or STILE, enables power regulation from system board to package. In-package power delivery frees up board ...

Today, Chipmind, the European startup building AI agents to accelerate IC development, is launching Chipmind Agents to ...

TSMC is to break ground on its 1.4nm fab in Taichung’s Central Taiwan Science Park on November 5th, says Taiwan’s Economic ...