Information Flow Verification at the Pre-silicon Stage Utilizing Static-Formal Methodology.” Abstract “Modern system-on-chips (SoCs) are becoming prone to numerous security vulnerabilities due to ...

The critical role of mechanical stress in FinFET performance and the importance of pitch control to minimize variability and optimize device parametric targets.

For decades, optical inspection has been the primary method for process control in fabs. However, the move to multi-level ...

Patterns created using advanced fault models provide higher test coverage, improved defect detection, and higher-yielding ...

Bonds and interconnects are especially problematic and require more test insertions. Ensuring reliability requires connecting fragmented data that is often siloed. The shift to multi-die assemblies is ...

In today’s advanced packages, however, resistance no longer resides primarily inside transistors or neatly bounded test ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV process steps, which include lithography patterning followed by deep reactive ion ...

Researchers from Rice University, University of Utah and National University of Singapore (NUS) published “Three-dimensional ...

Researchers from Fudan University designed a fiber integrated circuit (FIC) with a multilayered spiral architecture. The ...

Data center AI is driving a dramatic ramp in the growth of silicon photonics foundries: 8X growth in just 6 years, from 2026 to 2032. Scale-out is the major driver now. Scale-up will become the ...

Quantum computers may become a security threat as early as next year, and that threat will continue to grow over the next several years.

Consider a smart home display that uses Wi-Fi, Bluetooth mesh and local voice recognition. The embedded processor manages the wireless protocols, runs the voice model and powers the user interface.