Researchers at UCSD and Columbia University published “ChipBench: A Next-Step Benchmark for Evaluating LLM Performance in AI-Aided Chip Design.” Abstract “While Large Language Models (LLMs) show ...
Verifying an extensible processor is more than a one-step process, especially when software compatibility is important.
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may ...
Impact Of The Film Transfer And Grain Size On The Cu-barrier Properties Of 2D WS2 Films (NUS et al.)
A new technical paper titled “Enhancing Cu-barrier properties of 2D-WS2 barriers: The role of grain size and surface passivation” was published by researchers at National University of Singapore, ...
A cornerstone of effective STCO is the ability to conduct multi-domain analyses—for example, signal integrity, power ...
Synopsys’ Secure Storage Solution for OTP IP introduces a multi-layer security architecture that pairs antifuse OTP ...
A new technical paper titled “Towards Safe Autonomous Driving: A Real-Time Motion Planning Algorithm on Embedded Hardware” was published by researchers at TU Munich. Abstract “Ensuring the functional ...
2026 will continue to shine a spotlight on AI as it reshapes the EDA industry. Those companies that integrate AI into workflows, develop internal talent, and maintain the security posture required for ...
Understanding connectivity issues and interactions are only part of the problem; ECOs can cause unexpected problems in other ...
A new technical paper titled “Pushing the Envelope of LLM Inference on AI-PC and Intel GPUs” was published by researcher at ...
With the advancement in AI networks and low-power inference devices, such as DSPs and NPUs, the time is right for voice-based user interfaces.
Hardware-based security; 3D-IC challenges, opportunities; resource-constrained graphics; silicon photonics; edge AI speech ...
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