Rust-resistant coating for 2D semiconductors; polymeric material for data storage and encryption; quantum-secure deep ...

Ensuring data gets to where it’s supposed to go at exactly the right time is a growing challenge for design engineers and ...

Perfection sometimes stands in the way of progress, and there is evidence this may be happening with chiplets. It may be time ...

A new technical paper titled “Towards Fine-grained Partitioning of Low-level SRAM Caches for Emerging 3D-IC Designs” was ...

A Compact Behavioral Model for Volatile Memristors” was published by researchers at Technion – Israel Institute of Technology ...

Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. Key drivers are the regionalization of semiconductor fabs and the increasing ...

A new technical paper titled “Breakthrough low-latency, high-energy-efficiency LLM inference performance using NorthPole” was published by researchers at IBM Research. At the IEEE High Performance ...

A new technical paper titled “Hardware Acceleration of Kolmogorov-Arnold Network (KAN) for Lightweight Edge Inference” was ...

A new technical paper titled “Bendable non-silicon RISC-V microprocessor” was published by researchers at Pragmatic Semiconductor, Qamcom,  and Harvard University. From the abstract: “Here we present ...

A new technical paper titled “Using both faces of polar semiconductor wafers for functional devices” was published by ...