In today’s advanced packages, however, resistance no longer resides primarily inside transistors or neatly bounded test ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV process steps, which include lithography patterning followed by deep reactive ion ...

For decades, optical inspection has been the primary method for process control in fabs. However, the move to multi-level ...

Patterns created using advanced fault models provide higher test coverage, improved defect detection, and higher-yielding ...

Information Flow Verification at the Pre-silicon Stage Utilizing Static-Formal Methodology.” Abstract “Modern system-on-chips (SoCs) are becoming prone to numerous security vulnerabilities due to ...

The critical role of mechanical stress in FinFET performance and the importance of pitch control to minimize variability and optimize device parametric targets.

Researchers from Rice University, University of Utah and National University of Singapore (NUS) published “Three-dimensional ...

Researchers from Fudan University designed a fiber integrated circuit (FIC) with a multilayered spiral architecture. The ...

Data center AI is driving a dramatic ramp in the growth of silicon photonics foundries: 8X growth in just 6 years, from 2026 to 2032. Scale-out is the major driver now. Scale-up will become the ...

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may ...

D-IC thermal management & KGD strategies; system-level engineering; within-wafer variability; image segmentation.