AI squeezes consumer memory market; 3D-IC basics, challenges; atomistic simulation; GPUs and auto security; AI-assisted ...

AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge ...

ALD for Ru wiring; vertical nanolasers; hydrogel semiconductors.

Semiconductor Engineering tracked 12 rounds of $100 million or more in Q4 and 11 in Q3, a significant increase from earlier ...

John Kibarian, CEO of PDF Solutions, talks with Semiconductor Engineering’s Ed Sperling about the growing role of AI in chip ...

A new technical paper titled “Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation ...

Beyond cold plates lies what’s sometimes called direct impingement, or direct liquid cooling (DLC), meaning that coolant ...

PPA constraints need to be paired with real workloads, but they also need to be flexible to account for future changes.

Introducing multiple Arm64 variants of the JIT_WriteBarrier function. Each variant is tuned for a GC mode. Because many parts ...

The AI hardware landscape continues to evolve at a breakneck speed, and memory technology is rapidly becoming a defining ...

Today, teams often rely on disconnected logs, postmortems, and ad-hoc debug when failures emerge in the field. Lifecycle ...

A new technical paper titled “Process and materials compatibility considerations for introducing novel extreme ultraviolet ...