Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron plans to invest around $7 billion over the next five years to boost memory chip production in Singapore. The company ...

The company has plans to demo its next-gen 16-layer HBM3E prototype alongside a high-capacity enterprise SSD, and new ...

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

Micron Technology initiated construction on (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging ...

Micron’s data center revenue surged 4X YoY and 40% sequentially in Q1-FY25, contributing 55% of consolidated revenue. High ...

Driven by growing chip demand in 2025, analysts at Jefferies predict ASML Holding ( ASML) will likely enjoy a boom in orders ...

Talk about artificial intelligence and you immediately think about Nvidia (NASDAQ:NVDA), Broadcom (NASDAQ:AVGO), or even ...

Nvidia’s CEO Jensen Huang expressed confidence that Samsung will overcome challenges in producing high-bandwidth memory chips ...

Mizuho analysts project a positive 2025 for chipmakers, supported by robust artificial intelligence (AI) demand, data center ...

Explore the NVIDIA GeForce RTX 5090: unmatched power, advanced cooling, and next-gen connectivity for gamers and ...