Warpage is shifting from a global bow specification to a process-dependent surface-shape problem that affects bonding, alignment, lithography, reliability, and downstream assembly. Panel-level ...

HW methods to throttle AI; M3D DRAM; interconnect signal-integrity analysis; 3D mask effects in high/hyper-NA EUV litho; ...

This research is significant in that it proposes a new design principle that allows the flow of light within photonic ...

Scaling NoCs across chiplets requires earlier validation of coherency, congestion, thermal effects, and fault behavior.

Change is coming, but how quickly depends on the availability of data and when chipmakers are confident enough to let AI take over.

AI-driven compute demands have led to several distinct supply chain bottlenecks for data centers. Legacy power management ...

Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process ...

Modern engineering software was built around an assumption that made sense for its time: different physics problems required different tools, solvers, and workflows. Structural analysis lived in one ...

Photonics is forcing EDA to verify not just chips, but the physics of light inside full electro-optical systems.

Hyperspectral imaging is making a difference in surgery, disease diagnostics, and water conservation. Inverse lithography technology (ILT) finds a new application in reticle stitching. Leaders are ...

As we’ve observed over our recent blogs, the semiconductor industry is reckoning internally with technological questions on densification, scale, overcoming the memory wall, making data movement more ...