Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

Expertise from Forbes Councils members, operated under license. Opinions expressed are those of the author. A lot has changed since then: Cloud platforms have replaced mainframes, minis, client-server ...

Address overall system optimization across different fields of expertise, abstraction levels or hierarchies, and domains of ...

Two companies are joining forces to make the home design process a little less stressful for homebuyers and builders. Walk Your Plans projects residential and commercial floor plans at full scale on a ...

AV industry designers and technologists from Arup, People Technology Space (PTS), and HB Communications share how they approach the relationship between technology and building design. When you ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., the world leader in semiconductor technology, today announced that it has started initial production of its 3-nanometer (nm) process ...

The cooling system employs microfluidics to direct liquid coolant into silicon chips through etched channels for efficient ...

WASHINGTON, D.C. – On April 13, the Cybersecurity and Infrastructure Security Agency (CISA), along with the Federal Bureau of Investigation (FBI), the National Security Agency (NSA), and the ...

On March 17, 2025, China's leading EDA software company, Empyrean Technology, announced plans to acquire a majority stake in Shanghai-based Xpeedic Technology, a provider of EDA and system-in-package ...

TerraPower has formally notified UK regulators that it plans to begin the generic design approval process for its Natrium sodium-cooled fast reactor, a first step towards deploying the technology in ...

"Nissan to close US and Brazil design studios, scale back in London and Japan" was originally created and published by Just ...