MILPITAS, Calif., Sept. 21, 2020 /PRNewswire/ -- Today, KLA Corporation (NASDAQ: KLAC) announced the launch of the Kronos™ 1190 wafer-level packaging inspection system, the ICOS™ F160XP die sorting ...

Did you know that processors, and other packaged integrated circuits, often contain more than one die (aka chip)? It’s not something you can tell by looking at them. Did you know that processors, and ...

You’re probably familiar with the little black boxes nestled neatly inside your favorite devices. With their diminutive size and unassuming characteristics, it can be hard to believe these vessels are ...

Hillsboro, Ore.—TriQuint Semiconductor announced the availability of the first three packaged devices in its Multi-Function Circuit (MFC) family. The MFC products, initially released as die-level ...

Traditionally, the packaged integrated circuit (IC) has been much larger than the IC itself because standard packages must also contain the lead-frame and bond wires. That wasn’t an issue for decades ...

An integrated circuit (IC), also known as a microchip or chip, is a miniaturized electronic circuit consisting of transistors, resistors, capacitors, and other components fabricated onto a single ...

Years ago, Tektronix could not justify an expensive, high-performance semiconductor operation solely for producing competition-defeating ICs for oscilloscopes, and formed a joint venture with Maxim ...

This new report looks at key market players, emerging materials (such as TFLN, and BTO), and new applications such as AI, to forecast the growth of the Silicon Photonics and Photonic Integrated ...

The newest current sensor family from Allegro MicroSystems, Inc., the ACS704, is the first SOIC8-packaged Hall-effect current sensor with the current path integrated into the package for greater ...