BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...

During electrical design process, certain design choices need to be made. One example is USB C type connector-based design with a straddle-mount connector. In such scenario, the overall PCB thickness ...

BioOptro is showing strong performance. The company is expected to continue improving its results as it has become the second in the world to develop BBT (Bare Board Tester) equipment specialized for ...

Accommodating IC packages such as the JEDEC MO-207 BGA with a 0.8 mm pitch and 21 x 9 arrays with up to 189 balls, the SG-BGA-6103 BGA socket exhibits a 6.5 GHz bandwidth and supports dense BGA ...

Supporting a 10-GHz bandwidth, the SS-BGA324K-01 socket accommodates BGA ICs with a 0.5-mm pitch and can dissipate up to 7W without a heatsink or up to 60W with a custom heatsink. The component can ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.